Looking for a reliable solution to keep your CPU cool under pressure? Look no further than REGZ20 Heat Sink Compound – 25g. This compound is designed to provide excellent heat dissipation between your CPU and heatsink, ensuring optimal performance even during extreme voltage applications.

• Blend of silicone and zinc oxide compounds
• Viscosity of 1650-1900 poise at 25C
• Enables maximum thermal transfer

With a trusted blend of silicone and zinc oxide compounds, this heat sink compound offers a viscosity of 1650-1900 poise at 25C, allowing for maximum thermal transfer. Say goodbye to overheating and hello to seamless cooling with REGZ20 Heat Sink Compound – 25g.